The Center for Neovation houses some of the most advanced semiconductor fabrication facilities—high-tech environments where semiconductor chips are created. These plants act as specialized workshops where researchers explore and develop new materials and designs. The fabrication process involves precise steps to build semiconductor chips, allowing scientists to prototype, test, and improve new ideas to enhance semiconductor performance.

The Center for Neovation has two types of cleanrooms: a Class 1,000 cleanroom and a Class 10,000 cleanroom. These cleanrooms are crucial for keeping out contaminants that could disrupt the delicate process of making semiconductor chips.

The Class 1,000 cleanroom is stricter, allowing only 1,000 tiny particles per cubic foot of air, while the Class 10,000 cleanroom allows up to 10,000 particles per cubic foot. Both are cleaner than normal air, with about 35 million particles per cubic foot.

This high level of cleanliness is especially important for sensor development, where tiny components detect environmental changes, such as light, heat, or pressure. Even a small amount of dust could disrupt these delicate components, so maintaining a clean environment is essential for proper functioning.

A Leading Facility for Breakthrough Research

The Center for Neovation also has specialized labs and research areas designed for various aspects of semiconductor research. Here, scientists work on creating new materials to improve chip performance and designing layouts to make electronic devices more efficient. Each lab is equipped with advanced tools to help researchers refine these components.

A unique feature of the Center is its 6-million-pound elevated waffle slab—a thick, grid-patterned concrete platform that minimizes vibrations and provides a stable foundation for sensitive research equipment. This slab supports up to 300 research tools, allowing scientists to conduct sensitive experiments without disruption, attracting top talent, and making NeoCity a leader in semiconductor research.

Revolutionizing Technology with Advanced Packaging

Another focus at the Center for Neovation is advanced packaging technology. This involves how semiconductor chips are enclosed and connected to other components. As chips become smaller and more powerful, advanced packaging helps make devices more compact, faster, and energy-efficient. For instance, in aerospace, this technology allows for lighter and more powerful navigation systems, while in the medical field, it creates smaller and more precise imaging equipment.

Researchers at the Center are developing new packaging methods that improve performance and reduce environmental impact. These innovations often start in specialized industries like aerospace and medicine but eventually make their way into everyday products like smartphones and wearable devices, improving efficiency and performance for everyone.