2024 IMAPS Advanced Technology Workshop
August 28, 2024 - August 28, 2024
The focus is on manufacturing low volume, highly customized chips which have little or no broad-based
demand by the average consumer, but are highly sought after by the aerospace, defense, and
medical industries because those industries operate in extreme environments that often require
microchips with specific functions in very low volumes. Large scale, commercial fabs do not make these
types of chips because they either do not meet aerospace, defense, and extreme environment
requirements or the way they are produced does not meet the system developer’s security needs.
This workshop will bring together the scientists, engineers, manufacturing, academia, business and
people from around the world who work in the area of smart sensors, systems and advanced packaging
technology. This workshop and tabletop exhibits enable discussion and presentations on the latest
semiconductor-based design, process and materials for smart sensor and photonic technologies.
• Fan-Out Wafer-Level Packaging (FOWLP)
• Silicon and Glass Substrates/Interposers
• Hybrid Bonding
• Chiplet Technology
• Additive Manufactured Electronics (AME)
• Interconnect Materials
• Novel Die Interconnect
• Digital workflow & Cybersecurity
• Design, Simulation and Modeling
• In Situ Metrology & Machine Learning
• Digital Twin,
• CHIPS and SHIPS
• On Shoring
• TSV’s & TGV’s
On Shoring of the semiconductor supply chain is driving the need for new advanced packaging and digital
manufacturing strategies and application/mission specific System in Packaging technologies
Details
Date
August 28, 2024
August 28, 2024
Time
Start: 7:00 am
End: 7:00 pm