IMAPS Advanced Technical Workshop and Tabletop

This workshop will explore the specialized world of low-volume, high-customization chip manufacturing—an area critical to industries like aerospace, defense, and medical technology. These sectors operate in extreme environments and require semiconductors with unique functions that are not produced in mass-market commercial fabs. Due to stringent performance, environmental, and security demands, traditional manufacturing processes fall short, creating a growing need for mission-specific chips that meet precise technical and reliability standards.

Bringing together scientists, engineers, academics, and business leaders from across the globe, this workshop offers a dynamic platform to discuss the latest innovations in smart sensors, systems, and advanced packaging technologies. Through technical sessions and tabletop exhibits, attendees will engage with cutting-edge developments in Fan-Out Wafer-Level Packaging (FOWLP), hybrid bonding, chiplet architectures, additive manufactured electronics (AME), and more. Topics will also include digital workflows, cybersecurity, simulation and modeling, and onshoring strategies aligned with CHIPS and SHIPS initiatives. As the semiconductor industry moves toward more resilient, secure, and digitally driven systems, this workshop serves as a vital forum for advancing next-generation packaging and system integration solutions.

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