US-Korea Semiconductor Aerospace Forum

Primary goal of the US-Korea Aerospace Semiconductor & Packaging forum is to strengthen technological cooperation between the U.S. and Korea, with a particular focus on high-performance semiconductor and packaging solutions that are essential to the next generation of space technologies. 

This forum serves as a dynamic platform for sharing cutting-edge research, emerging trends, and real-world applications that are shaping the future of the aerospace industry. 

Through keynote presentations, panel discussions, and networking opportunities, the forum aims to spark new ideas, form strategic partnerships, and accelerate progress in this vital area of innovation.

Forum is sponsored by RFMTL, KU-SRCC, and the Republic of Korea Consulate General.